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3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press) 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)
Hardcover
Edition:
1
Lih-tyng Hwang
Tzyy-sheng Jason Horng
Publisher:
IEEE
Release Date:
2018
ISBN-10:
1119289645
ISBN-13:
9781119289647
List Price: 
$155.00
Cheapest Price Summary

Used: $142.85

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Price:
$140.21
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Total:
$142.85
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$154.99

Semester Rental: $123.41

Knetbooks
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$123.41
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Total:
$123.41

55 Day Rental: $111.07

Knetbooks
Price:
$111.07
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Total:
$111.07

Cheapest Price Summary

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Abebooks
(Marketplace)
Used
Used $140.21
as of 1 second ago
$2.64
Abebooks
(Marketplace)
New
New $152.35
as of 1 second ago
$2.64
Knetbooks
Semester Rental
(Due Date 08/02/2024)
Semester Rental
(Due Date 08/02/2024)
$123.41
as of 1 second ago
FREE
Knetbooks
55 Day Rental
(Due Date 06/21/2024)
55 Day Rental
(Due Date 06/21/2024)
$111.07
as of 1 second ago
FREE
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