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3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press) 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)
Hardcover
Edition:
1
Lih-tyng Hwang
Tzyy-sheng Jason Horng
Publisher:
IEEE
Release Date:
2018
ISBN-10:
1119289645
ISBN-13:
9781119289647
List Price: 
$166.95
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Used: $142.36

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Semester Rental: $117.25

Knetbooks
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$117.25
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55 Day Rental: $111.07

Knetbooks
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$111.07
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Total:
$111.07

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Abebooks
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Used
Used $139.72
as of 1 second ago
$2.64
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New
New $152.45
as of 1 second ago
$2.64
Knetbooks
Semester Rental
(Due Date 08/16/2024)
Semester Rental
(Due Date 08/16/2024)
$117.25
as of 1 second ago
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61 Day Rental
(Due Date 07/08/2024)
61 Day Rental
(Due Date 07/08/2024)
$111.07
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