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Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications
Hardcover
Edition:
2015
Shichun Qu
Yong Liu
Publisher:
Springer
Release Date:
2014
ISBN-10:
149391555X
ISBN-13:
9781493915552
List Price: 
$179.00
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New: $140.71

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eBook: $50.70

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$50.70
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180 Day eBook
(Expire Date 10/21/2026)
180 Day eBook
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