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Through-Silicon Vias for 3D Integration Through-Silicon Vias for 3D Integration
Hardcover
Edition:
1
Author:
John H. Lau
Publisher:
McGraw Hill
Release Date:
2012
ISBN-10:
0071785140
ISBN-13:
9780071785143
List Price: 
$179.00
Cheapest Price Summary

Used: $86.81

Amazon
(Marketplace)
Price:
$82.82
Shipping:
$3.99
Total:
$86.81

New: $104.74

Amazon
Price:
$100.75
Shipping:
$3.99
Total:
$104.74

eBook: $145.80

Textbooks.com
Price:
$145.80
Shipping:
$0.00
Total:
$145.80

Cheapest Price Summary

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Amazon
(Marketplace)
Used
Used

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$82.82
as of 4 seconds ago
$3.99
Amazon
New
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Details: Get FREE Shipping with a $25+ purchase
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$100.75
as of 4 seconds ago
$3.99
FREE, with $25 purchase
Textbooks.com
1825 Day eBook
(Expire Date 03/13/2031)
1825 Day eBook
(Expire Date 03/13/2031)
$145.80
as of 4 seconds ago
FREE
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