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Through-Silicon Vias for 3D Integration Through-Silicon Vias for 3D Integration
Hardcover
Edition:
1
Author:
John H. Lau
Publisher:
McGraw Hill
Release Date:
2012
ISBN-10:
0071785140
ISBN-13:
9780071785143
List Price: 
$179.00
Cheapest Price Summary

Used: $236.10

Abebooks
(Marketplace)
Price:
$233.46
Shipping:
$2.64
Total:
$236.10
Price:
$106.54
Shipping:
$0.00
Total:
$106.54

eBook: $145.80

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Price:
$145.80
Shipping:
$0.00
Total:
$145.80

Sell Back: $0.70

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$0.70
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Total:
$0.70

Cheapest Price Summary

Store  Condition  Coupons & Deals  Price  Shipping  Total 
Abebooks
(Marketplace)
Used
Used $233.46
as of 4 seconds ago
$2.64
Abebooks
(Marketplace)
New
New $106.54
as of 4 seconds ago
FREE
BiggerBooks
1825 Day eBook
(Expire Date 05/02/2030)
1825 Day eBook
(Expire Date 05/02/2030)
$145.80
as of 4 seconds ago
FREE
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