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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Hardcover
Edition:
1
John H. Lau
Yi-Hsin Pao
Publisher:
McGraw-Hill Professional
Release Date:
1996
ISBN-10:
0070366489
ISBN-13:
9780070366480
List Price: 
$65.00
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