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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Hardcover
Edition:
1
Sheng Liu
Yong Liu
Publisher:
Wiley
Release Date:
2011
ISBN-10:
0470827807
ISBN-13:
9780470827802
List Price: 
$166.25
Cheapest Price Summary

Used: $158.11

Abebooks
(Marketplace)
Price:
$155.47
Shipping:
$2.64
Total:
$158.11
Buy Nowclick here!

New: $153.73

Abebooks
(Marketplace)
Price:
$151.09
Shipping:
$2.64
Total:
$153.73
Buy Nowclick here!

Cheapest Price Summary
Store  Condition  Coupons & Deals  Price  Shipping  Total 
Abebooks
(Marketplace)
Used
Used $155.47
as of 4 seconds ago 		$2.64
$158.11
6% off $158.11Buy Nowclick here!
Abebooks
(Marketplace)
New
New $151.09
as of 4 seconds ago 		$2.64
$153.73
9% off $153.73Buy Nowclick here!
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