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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press) 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)
Hardcover
Edition:
1
Lih-Tyng Hwang
Tzyy-Sheng Jason Horng
Publisher:
Wiley-IEEE Press
Release Date:
2018
ISBN-10:
1119289645
ISBN-13:
9781119289647
List Price: 
$166.95
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Semester Rental: $123.41

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Used
Used $142.32
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$2.64
Knetbooks
Semester Rental
(Due Date 08/05/2024)
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$123.41
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60 Day Rental
(Due Date 05/27/2024)
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